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Patent Searching and Data


Title:
APPARATUS FOR PROCESSING CUT PORTION OF GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2015/178647
Kind Code:
A1
Abstract:
The present invention relates to an apparatus for processing a cut portion of a glass substrate, comprising: a heating member; heating member supports; and a glass substrate support, wherein the heating member supports and/or the glass substrate support are movably provided so that the cut portion of the glass substrate fixed to the glass substrate support can be sequentially brought into contact. The heating member comprises a bi-directional contact part or a tri-directional contact part which is brought into contact with the cut portion of the glass substrate, wherein contact surfaces in both directions of the bi-directional contact part are connected so as to form an interior angle which is larger than 10 degrees and smaller than 180 degrees, and wherein the tri-directional contact part comprises one perpendicular contact surface, which is brought into contact with a perpendicular surface of the cut portion of the glass substrate, and two edge contact surfaces, wherein the edge contact surfaces are connected so as to form an interior angle which is larger than 90 degrees and smaller than 180 degrees at two ends of the perpendicular contact surface.

Inventors:
SON DONG-JIN (KR)
KIM DONG-HWAN (KR)
KIM JONG-MIN (KR)
TAK GWANG-YONG (KR)
Application Number:
PCT/KR2015/004971
Publication Date:
November 26, 2015
Filing Date:
May 18, 2015
Export Citation:
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Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
B26F3/08; C03B29/00; C03B33/08
Foreign References:
KR20110008373A2011-01-27
KR20010057008A2001-07-04
KR20130081541A2013-07-17
KR20030054720A2003-07-02
KR20120102549A2012-09-18
Attorney, Agent or Firm:
Hanyang Patent Firm (KR)
한양특허법인 (KR)
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