Title:
APPARATUS FOR PROCESSING MICRO-COMPONENTS USING LASER
Document Type and Number:
WIPO Patent Application WO/2016/085046
Kind Code:
A1
Abstract:
The present invention relates to an apparatus for processing micro-components using a laser. According to one aspect of an apparatus for processing micro-components using a laser of the present invention, an apparatus for processing micro-components using a laser, which forms a hole by means of a laser irradiated on a surface of an object to be processed, comprises: a laser irradiation part which irradiates a laser; an optical axis translation part which translates the optical axis of the laser irradiated by the laser irradiation part; an optical axis angle adjustment part which adjusts the angle of the optical axis of the laser translated by the optical axis translation part; a reflection part which reflects the laser of which the angle of the optical axis has been adjusted by the optical axis adjustment part; and a focusing lens which focuses the laser reflected by the reflection part on a surface of an object to be processed.
Inventors:
YOO SU YOUNG (KR)
Application Number:
PCT/KR2015/001774
Publication Date:
June 02, 2016
Filing Date:
February 24, 2015
Export Citation:
Assignee:
FRIENDS CO LTD T (KR)
International Classes:
B23K26/384; B23K26/064
Foreign References:
| JP2005262251A | 2005-09-29 | |||
| KR20140028196A | 2014-03-10 | |||
| JP2000271772A | 2000-10-03 |
Attorney, Agent or Firm:
BAE, DONG HWAN (KR)
배동환 (KR)
배동환 (KR)
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