APPARATUS FOR REFINING SEMICONDUCTOR OR METAL

WIPO Patent Application WO/2013/099365

A1

A cooling body (100) has a hollow rotating shaft section (120), and a hollow immersion section (110), which is a portion communicated with the rotating shaft section (120), and immersed in a molten semiconductor or a molten metal. The immersion section (110) is configured of a cylindrical circumferential side surface, and a bent bottom surface continuous from the circumferential side surface. Piping (130) for circulating a cooling fluid that cools the cooling body (100) is provided inside of the rotating shaft section (120). An outlet section (140), which is communicated with the piping (130), and which has a plurality of outlet ports (141) for blowing out the cooling fluid toward the inner surface of the immersion section (110), is provided on the inner side of the immersion section (110). The outlet ports (141) are positioned on the side surface and the bottom surface of the outlet section (140). A distance (L2) between an upper end position of an upper end outlet port positioned at the top among the outlet ports (141) positioned on the side surface of the outlet section (140), and a lower end position of the immersion section (110) is equal to or shorter than half a distance (L1) between an upper end position of the immersion section (110) and a lower end position of the immersion section (110).

NAKANO TAKAHIRO
WADA KENJI
NAGATA YOSHIHIKO

PCT/JP2012/073283

July 04, 2013

September 12, 2012

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SHARP KK (JP)
NAKANO TAKAHIRO
WADA KENJI
NAGATA YOSHIHIKO

C01B33/037; C22B9/02

JPH09188512A	1997-07-22
JPS57210932A	1982-12-24
JP2000053411A	2000-02-22

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

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