Title:
APPARATUS FOR SLICING INGOT
Document Type and Number:
WIPO Patent Application WO/2012/115462
Kind Code:
A2
Abstract:
Provided is an apparatus for slicing an ingot. The apparatus for slicing the ingot includes a mounting part on which the ingot is mounted, a wire saw disposed under the mounting part, a slurry supply part supplying slurry from an upper side of the wire saw, and a slurry blocking part disposed on the mounting part. The slurry blocking part includes a fixing part coupled to one side of the mounting part and a slurry collection part to which a central portion thereof is coupled to a lower portion of the fixing part.
Inventors:
JEON DAE HYUN (KR)
Application Number:
PCT/KR2012/001384
Publication Date:
August 30, 2012
Filing Date:
February 23, 2012
Export Citation:
Assignee:
LG SILTRON INC (KR)
JEON DAE HYUN (KR)
JEON DAE HYUN (KR)
International Classes:
B28D5/04; B28D7/04
Foreign References:
| JP2009535224A | 2009-10-01 | |||
| JPH11277395A | 1999-10-12 | |||
| JP2002283208A | 2002-10-03 | |||
| JP2004322299A | 2004-11-18 |
Other References:
See references of EP 2613919A4
Attorney, Agent or Firm:
SEO, Kyo-Jun (Hyun Juk Bldg.832-41 Yeoksam-dong, Gangnam-gu, Seoul 135-080, KR)
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Claims:
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