Description

APPARATUS FOR SORTING SEMICONDUCTOR DEVICE

Technical Field

[1] The present disclosure relates to an apparatus for sorting semiconductor devices, and more particularly, to an apparatus for sorting semiconductor devices capable of automatically sorting semiconductor devices according to test result. Background Art

[2] In a process for manufacturing a semiconductor device, a semiconductor device having undergone a package process has to undergo various tests such as electric characteristic test and reliability test against heat or pressure. The various tests include a Burn-In test. According to the Burn-In test, a plurality of semiconductor devices are inserted into a Burn-In Board (BIB), and the BIB is accommodated in a Burn-In test apparatus. Then, heat or pressure is applied to the BIB for a certain time, and it is tested whether inferiority occurs at the semiconductor devices.

[3] An apparatus for sorting semiconductor devices by a Burn-In test generally sorts good semiconductor devices to a tray from the BIB on which semiconductor devices having been Burn-In tested, and additionally sorts bad semiconductor devices. Then, the apparatus for sorting semiconductor devices inserts new semiconductor devices to be tested into an empty portion (socket) of the BIB.

[4] Before new semiconductor devices are loaded on the BIB for a Burn-In test, the new semiconductor devices undergo a DC test. According to the DC test, whether semiconductor devices are short-circuited or opened are tested, and only semiconductor devices having a normal DC characteristic are loaded on the BIB whereas semiconductor devices having an abnormal DC characteristic are separately sorted.

[5] Performance of the apparatus for sorting semiconductor devices is evaluated according to a Units Per Hour (UPH) which is the number of sorted semiconductor devices per hour. One of the most important factors to enhance the UPH is a lay-out for making an arrangement of each component of the apparatus for sorting semiconductor devices. A better lay-out for the apparatus for sorting semiconductor devices directly influences on an efficient arrangement for each component of the apparatus for sorting semiconductor devices, and an enhanced UPH.

[6] Furthermore, the UPH is determined according to a time duration for which the semiconductor devices or the board are transferred between each component of the apparatus for sorting semiconductor devices. Disclosure of Invention Technical Problem

[7] Therefore, an object of the present disclosure is to provide an apparatus for sorting semiconductor devices capable of more rapidly sorting semiconductor devices by properly arranging each component thereof.

[8] Another object of the present disclosure is to provide an apparatus for sorting semiconductor devices capable of enhancing a UPH by reducing a time taken to replace a board on which semiconductor devices are loaded by another between an X-Y table and a board loader.

[9] Still another object of the present disclosure is to provide an apparatus for sorting semiconductor devices capable of enhancing a UPH by rapidly replacing a rack by another in a board loader. Technical Solution

[10] To achieve these and other advantages and in accordance with the purpose of the present disclosure, as embodied and broadly described herein, there is provided an apparatus for sorting semiconductor devices, comprising: a board loader on which a plurality of boards are loaded, each of the boards having semiconductor devices loaded thereon; and a sorting unit installed at one side of the board loader, for receiving a board from the board loader and sorting semiconductor devices loaded on a board, wherein the sorting unit includes a board loading device for performing withdrawing a board loaded on the board loader and returning a sorted board to the board loader.

[11] The board loading device may include one pair of link units installed in upper and lower directions, the pair of the link units withdrawing a board loaded on the board loader and returning a sorted board to the board loader by being linked with the respective boards; and a linear driving device for linearly-moving the link units thereby withdrawing a board linked to the link units from the board loader or transferring a sorted board linked to one of the link units to the board loader.

[12] The link units may include a hooking member linked or unlinked to/from a locking portion formed at the board by being rotated, and a rotating device for rotating the hooking member. The one pair of link units may be configured to move independently from each other.

[13] To achieve these and other advantages and in accordance with the purpose of the present disclosure, as embodied and broadly described herein, there is also provided a board loader of an apparatus for sorting semiconductor devices, comprising: a rack loading unit having at least one loading deck for loading a rack on which a plurality of boards are loaded; and a board supplying unit installed at one side of a sorting unit for sorting semiconductor devices loaded on a board, for supplying a board on which semiconductor devices are loaded to the sorting unit, and receiving a sorted board, wherein at least one of the rack loading unit and the board supplying unit includes a

lock member locked by a locking portion formed at the rack, and a rack transferring unit having a rack transferring device for transferring a rack between the rack loading unit and the board supplying unit by moving the lock member.

[14] The board supplying unit includes an elevator unit for vertically moving a loaded rack, and the rack transferring unit may be installed at the elevator unit.

[15] The locking unit may be implemented as a locking jaw or a slot formed at the rack, and the lock member may be configured to be locked or unlocked to/from the locking jaw or the slot by being rotated.

[16] The rack transferring unit may include a linear moving device for moving a rack by linearly-moving the lock member. The linear moving device may include a screw unit installed at the board supplying unit, the screw unit being rotatable, and a moving member coupled to the lock member and linearly-moved together with the screw unit as the screw unit is rotated, for moving the lock member.

[17] To achieve these and other advantages and in accordance with the purpose of the present disclosure, as embodied and broadly described herein, there is still also provided an apparatus for sorting semiconductor devices comprising: a board loader on which a plurality of boards are loaded, each of the boards having semiconductor devices loaded thereon; a sorting unit installed at one side of the board loader, for receiving a board from the board loader and sorting semiconductor devices loaded on the board, a board loading device comprising one pair of link units installed in upper and lower directions, for performing withdrawing a board loaded on the board loader and returning a sorted board to the board loader by being linked with the boards; and a linear driving device for linearly-moving the link units thereby withdrawing a board linked to the link units from the board loader or transferring a sorted board to the board loader.

Advantageous Effects

[18] The apparatus in accordance with the present invention has an advantage in that the remove pocket unit is installed on the unloading tray unit, an entire size of the apparatus for sorting semiconductor devices can be reduced. [19] Also, the apparatus in accordance with the present invention has an advantage in that time taken to replace a board on which semiconductor devices are loaded by another between the X-Y table and the board loader is shortened, thereby enhancing

UPH. [20] Also, the apparatus in accordance with the present invention has an advantage in that a rack is rapidly replaced by another in the board loader, thereby enhancing a

UPH.

Brief Description of the Drawings

[21] FIG. 1 is a conceptual view showing an apparatus for sorting semiconductor devices according to the present invention; [22] FIG. 2 is an arrangement view showing an example of the apparatus for sorting semiconductor devices of FIG. 1 according to the present invention; [23] FIG. 3 is a conceptual view showing transferring process for a semiconductor device in the apparatus for sorting semiconductor devices of FIG. 2 according to the present invention; [24] FIG. 4 is an arrangement view showing another example of the apparatus for sorting semiconductor devices of FIG. 1 according to the present invention; [25] FIG. 5 is a conceptual view showing transferring process for a semiconductor device in the apparatus for sorting semiconductor devices of FIG. 4 according to the present invention; [26] FIG. 6 is a partial perspective view showing an X-Y table of the apparatus for sorting semiconductor devices of FIG. 1 according to the present invention; [27] FIG. 7 is a partial perspective view showing a board loading device of the X-Y table of FIG. 6; [28] FIG. 8 is a partial perspective view showing a modified example of the X-Y table of

FIG. 6 and the board loading device of FIG. 7; [29] FIGS. 9 to 12 are conceptual views each showing process for loading a board by the board loading device of FIG. 7; [30] FIG. 13 is a perspective view showing a board loader of the apparatus for sorting semiconductor devices of FIG. 1 according to the present invention; [31] FIG. 14 is a partial perspective view showing an elevator unit of the board loader of

FIG. 13; and [32] FIG. 15 is a partial perspective view showing a rack transferring unit of the elevator unit of FIG. 14.

Mode for the Invention [33] Hereinafter, an apparatus for sorting semiconductor devices according to the present invention will be explained in more detail with reference to the attached drawings. [34] As shown in FIG. 1, the apparatus for sorting semiconductor devices according to the present invention includes a sorting unit 10 for sorting semiconductor devices 2, and a board loader 20 installed at one side of the sorting unit 10 for loading a board 1. [35] The sorting unit 10 serves to sort semiconductor devices 2 loaded on a board 1 from the board loader 20 according to test result. The sorting unit 10 may be variously configured and arranged according to sorting purpose and design condition. FIGS. 2 and 4 show different arrangements of the apparatus for sorting semiconductor devices according to the present invention.

[36] Tests for the semiconductor devices 2 include not only a Burn-In test, but also an electric characteristic test such as a DC characteristic test.

[37] As shown in FIGS. 1, 2 and 4, the sorting unit 10 includes an X-Y table 110, a loading tray unit 120, an unloading tray unit 130, a remove pocket unit 140, a device sorting unit 150, a test unit 160, and a device transferring unit 170.

[38] As shown in FIGS. 2 and 4, the loading tray unit 120, the unloading tray unit 130, the remove pocket unit 140, the device sorting unit 150, the test unit 160, and the device transferring unit 170 of the sorting unit 10 may be properly arranged at a supporting frame 11 according to sorting purpose and efficiency.

[39] The X-Y table 110 is installed below the supporting frame 11, and receives a board

1 from the board loader 20 or returns a board 1 to the board loader 20 at the same time. Also, the X-Y table 110 is configured to be moved in X and Y directions under a state that a board 1 supplied from the board loader 20 is fixed so that semiconductor devices

2 can be withdrawn or inserted from/into a board 1 by the device transferring unit 170. [40] An opening 11a through which semiconductor devices 2 are withdrawn or inserted from/into a board 1 by the device transferring unit 170 is formed at the supporting frame 11. A socket press device for locking or unlocking semiconductor device 2 to/ from a socket of a board 1 when semiconductor devices 2 are to be inserted/withdrawn into/from the board 1 is installed.

[41] The loading tray unit 120 is installed near the opening 1 Ia so as to load semiconductor devices 2 on a board 1. The unloading tray unit 130 is also installed near the opening 1 Ia so as to unload semiconductor devices 2 from a board 1.

[42] The loading tray unit 120 and the unloading tray unit 130 respectively include one pair of guide rails 121 and 131 for guiding a motion of a tray 30, and a driving unit (not shown) for moving a tray 30. A tray 30 is provided with a plurality of mounting portions for mounting semiconductor devices 2. A tray 30 is configured to move in the Y direction of FIGS. 1, 2 and 4 with consideration of a transferring direction of the device transferring unit 170 (the X direction).

[43] The loading tray unit 120 and the unloading tray unit 130 are installed to load and unload semiconductor devices 2 to/from a board 1. Here, either the loading tray unit 120 or the unloading tray unit 130 may be installed according to an arrangement state, thereby performing both loading process and unloading process for semiconductor devices 2 at the same time.

[44] The test unit 160 serves to perform a simple test such as a DC characteristic test of semiconductor devices 2, and has a plurality of sockets 161 to be inserted with semiconductor devices 2 between the opening 11a and the loading tray unit 120.

[45] The test unit 160 may be configured to receive semiconductor devices 2 loaded on a board 1 thus to perform a test, and then to transfer a tested semiconductor devices 2 to

the loading tray unit 120. The test unit 160 may be also configured to receive semiconductor devices 2 from the loading tray unit 120 thus to perform a test, and then to load tested semiconductor devices 2 on a board 1. The test unit 160 transfers semiconductor devices 2 tested to be bad in contact test or DC test to the device sorting unit 150.

[46] As shown in FIGS. 2 and 4, the test unit 160 may transfer semiconductor devices 2 having bad test result in the Y direction, and then transfer them along a reject line separated from a good line along which semiconductor devices 2 having good test result are transferred by the device transferring unit 170.

[47] The remove pocket unit 140 receives the semiconductor devices 2 loaded on the board 1 to temporarily store them, and includes a plurality of sockets 141 to be inserted with semiconductor devices 2 between the opening 11a and the unloading tray unit 130.

[48] The remove pocket unit 140 may be configured to receive semiconductor devices 2 loaded on a board 1, and then to transfer semiconductor devices 2 to the device sorting unit 150 or the unloading tray unit 130 according to a tested result. The remove pocket unit 140 may be also configured to receive semiconductor devices 2 from the unloading tray unit 120 thus to load semiconductor devices 2 on a board 1. In a similar manner as the test unit 160, the remove pocket unit 140 may transfer semiconductor devices 2 having bad test result in the Y direction, and then transfer them along a reject line separated from a good line along which semiconductor devices 2 having good test result are transferred by the device transferring unit 170.

[49] As shown in FIGS. 2 and 4, the remove pocket unit 140 may be installed to overlap the unloading tray unit 150, etc. so as to reduce an installation area for the apparatus for sorting semiconductor devices.

[50] The device sorting unit 150 is configured to receive semiconductor devices 2 from the remove pocket unit 140 or the test unit 160 according to a test result of semiconductor devices 2. As shown in FIG. 2, the device sorting unit 150 may include a plurality of sorting tray units 151 for loading semiconductor devices 2 received from the remove pocket unit 140 or the test unit 160 according to a tested result.

[51] The number of the sorting tray units 151 may be varied according to the number of sorting conditions (good/bad, DC fail, mal-operation, re-inspection, etc.). The sorting tray units 151 include one pair of guide rails 151a for guiding a motion of a tray 30, and a driving unit (not shown) for moving a tray 30.

[52] In a similar manner to the loading tray unit 120, a tray 30 is configured to move at the sorting tray units 151 in the Y direction of FIGS. 2 and 4.

[53] As shown in FIG. 2, some of the sorting tray units 151 may be configured so that a plurality of trays 30 can be mounted on a loading plate 151b that moves along the

guide rails 151a. As shown in FIG. 4, the device sorting unit 150 may be composed of a plurality of the sorting tray units 151 disposed in parallel.

[54] A tray transferring device (not shown) for transferring trays 30 among the loading tray unit 120, the unloading tray unit 130 and the device sorting unit 150 may be installed above the loading tray unit 120, the unloading tray unit 130, and the device sorting unit 150.

[55] A tray rotating unit 182 for rotating a tray 30 while a tray 30 is transferred among the loading tray unit 120, the unloading tray unit 130 and the device sorting unit 150, and thereby removing semiconductor devices 2 remained in a tray 30 may be further installed.

[56] As shown in FIG. 2, a tray loading unit 183 for loading a tray 30 while a tray 30 is transferred among the loading tray unit 120, the unloading tray unit 130 and the device sorting unit 150, may be further installed.

[57] FIGS. 3 and 5 are views respectively showing transferring process for a semiconductor device in the apparatus for sorting semiconductor devices of FIGS. 2 and 4 according to the present invention. The semiconductor devices 2 are transferred by the device transferring unit 170. The device transferring unit 170 may be composed of one or more transferring tools 171 to 175.

[58] The transferring tool 171 is installed between a board 1 and the test unit 160. One transferring tool 171 may be installed. However, as shown in FIG. 2, one pair of transferring tools 171 and 172 may be installed. The one pair of transferring tools 171 and 172 can move by being fixed to the supporting plate 179 for movement convenience. When one transferring tool 172 is positioned over the test unit 160, another transferring tool 171 may be positioned over the remove pocket unit 130.

[59] A transferring tool 173 is installed between the test unit 160 and the loading tray unit 120, thereby transferring semiconductor devices 2 by being reciprocated.

[60] A transferring tool 174 is installed between the remove pocket unit 130 and a board

1, thereby transferring semiconductor devices 2 by being reciprocated. If the pair of transferring tools 171 and 172 are fixed to the supporting plate 179, the transferring tool 174 is not necessary since the transferring tool 171 performs a function of the transferring tool 174.

[61] A transferring tool 175 for transferring semiconductor devices 2 to the device sorting unit 150 according to a test result from the test unit 160 and the remove pocket unit 130 may be further installed.

[62] The transferring tool of the device transferring unit 170 forms a vacuum pressure at the end thereof, thereby absorbing and transferring a semiconductor device 2. The transferring tool is installed above the supporting frame 11 so as to be movable in up and down directions.

[63] The transferring tools may be configured to move in the X direction of FIGS. 2 and

4 for convenience of movement control, but are not necessarily limited to this. The transferring tools may be configured to transfer one or more semiconductor devices, that is, four or eight semiconductor devices.

[64] Referring to FIGS. 6 and 7, the X-Y table 110 includes a first movable table 111 installed to be movable along a first guide member 12 fixed below the supporting frame 11, a second movable table 113 installed to be movable along a second guide member 112 disposed on the first movable table 111 in a direction (X-axis) perpendicular to a moving direction of the first movable table 111 (Y-axis), and transferring unit (not shown) for transferring the first and the second movable tables 111 and 113.

[65] Any coupling for a linear motion between the first guide member 112 and the first movable table 111, and between the second guide member 112 and the second movable table 113 can be implemented as screw coupling, etc. An unexplained reference numeral 14 indicates a board supporting unit installed at the second movable table 113 so as to be vertically movable, by which the sorting unit 10 can sort semiconductor devices 2 loaded on a fixed board 1.

[66] The X-Y table 110 includes a board loading device 210 for withdrawing a board 1 loaded on the board loader 20 and returning a sorted board 1 on the board loader 20.

[67] As shown in FIGS. 6 and 12, the board loading device 210 includes one pair of link units 211 installed in upper and lower directions for performing withdrawing a board 1 loaded on the board loader 20 and returning a sorted board 1 to the board loader 20 by being moved and inked with a board 1,; and a linear driving device 212 installed on the second movable table 113 of the X-Y table 110, for linearly-moving the link units 211 thereby withdrawing a board 1 linked to the link units 211 from the board loader 20 or transferring a sorted boards to the board loader 20.

[68] The link units 211 include a hooking member 211a linked or unlinked to/from a locking portion Ia formed at a board 1 by being rotated, and a rotating device 21 Ib for rotating the hooking member 211a. The hooking member 21 Ia is rotatably installed at a supporting member 211c disposed at the linear driving device 212.

[69] Referring to FIGS. 6 and 7, the linear driving device 212 includes a linear moving guide portion 212a disposed on the second movable table 113, and a linear driving portion 212b for supporting the supporting member 211c that supports the hooking member 211a, and moving the hooking member 211a along the linear moving guide portion 212a.

[70] As shown in FIGS. 6 and 7, the pair of link units 211 may be rotatably installed at one supporting member 21 Ic so as to simultaneously move in pair. As shown in FIG. 8, one pair of supporting members 21 Ic for supporting the link units 211 may be

configured so that the link units 211 can move independently from each other. Here, the linear driving device 212 may be configured in pair.

[71] The pair of link units 211 may be installed in up and down directions, or may be arranged with a gap therebetween as shown in FIG. 8.

[72] FIGS. 9, 10, 11 and 12 show process for withdrawing or returning a board 1 from/to the board loader 20 by the board loading device 210 between the board loader 20 and the X-Y table 110. FIGS. 9 and 10 show process for withdrawing a board 1 from an upper portion of a rack, whereas FIGS. 11 and 12 show process for withdrawing a board 1 from a lower portion of a rack.

[73] As shown in FIGS. 9 or 11, the link units 211 of the board loading device 210 are transferred to a rack 3 of the board loader 20 by the linear driving device 212 so that a board 1 can be withdrawn from a rack 3 loaded on the board loader 20 thus to be transferred onto the X-Y table 110.

[74] When a board 1 is to be initially withdrawn from a rack 3, the link units 211 move towards the rack 3 without a board 1. However, when a board 1 has been loaded on the X-Y table, the link units 211 moves towards the rack 3 by being locked by the hooking member 21 Ia of the above link units 211.

[75] In order to insert a board 1 into an empty portion of the rack 3, the elevator unit 430 of the board loader 20 implements the empty portion of the rack 3 into a height of the board 1 to be transferred together with the link units 211.

[76] One link portion 211 inserts a board 1 into the empty portion of the rack 3, and the hooking member 21 Ia of the other link portion 211 is linked with the locking portion Ia of a board 1. As shown in FIGS. 10 and 12, one of the link units 211 transfer a board 1 onto the X-Y table 110 by the linear driving device 212.

[77] The link units 211 for withdrawing a board 1 from a rack 3 may be disposed at an upper side or a lower side. Accordingly, a vertical moving device (not shown) for moving a board 1 between the upper link portion 211 and the lower link portion 211 is further installed at the X-Y table.

[78] The board loading device 210 inserts a board 1 into a rack 3, and immediately withdraws another board 1 from the rack 3, thereby reducing the time taken to insert and withdraw boards 1 into/from the rack 3. Accordingly, an entire time to sort semiconductor devices 2 is reduced.

[79] Referring to FIGS. 13 and 15, the board loader 20 includes a rack loading unit 410 installed at one side of the sorting unit 10 so as to supply a board 1, and having at least one loading deck 411 for loading a rack 3 on which a plurality of boards 1 are loaded (two loading decks in this emodiment) ; and a board supplying unit 420 installed at one side of the sorting unit 10 for sorting semiconductor devices 2 loaded on a board 1, for supplying a board 1 on which semiconductor devices are loaded to the sorting unit 10,

and receiving the sorted boards 1.

[80] At least one of the rack loading unit 410 and the board supplying unit 420 includes a lock member 510 locked by a locking portion 3a of a rack 3, and a rack transferring unit 500 having a rack transferring device 520 for transferring a rack 3 by moving the lock member 510.

[81] The board supplying unit 420 may include an elevator unit 430 for vertically moving a loaded rack 3. A rack transferring unit 500 may be installed at the elevator unit 430.

[82] The elevator unit 430 includes a moving member 432 coupled to a screw unit 433 installed inside the board loader 20, the moving member 432 vertically moving along the screw unit 433, and a base unit 431 coupled to the moving member 432 for supporting a rack 3 and installing the rack transferring unit 500.

[83] The locking unit 3a may be implemented as a locking jaw or a slot formed at a rack

3, and the lock member 510 may be configured to be locked or unlocked to/from the locking jaw or the slot by being rotated. The locking jaw or the slot may not be additionally formed at a rack 3, but may be a part of a rack 3 itself.

[84] The lock member 510 is hinge-coupled to a rotation shaft 511 installed at the moving member 521 so as to be rotatable by a rotation driving device (not shown) that will be later explained.

[85] The rack transferring device 520 may be implemented as a linear moving device for linearly moving the lock member 510. The linear moving device may include a screw unit 522 installed at the board supplying unit 420 and rotated, and a moving member 521 coupled to the lock member 510 and linearly-moved along the screw unit 522 as the screw unit 522 is rotated, for moving the lock member 510.

[86] The rack transferring device 520 may be further provided with a pushing plate 530 for pushing a rack 3 at the time of moving a rack 3 to the rack loading unit 410.

[87] As shown in FIG. 15, the rack transferring unit 500 moves towards a rack 3 loaded on the rack loading unit 410, and rotates the lock member 510 thus to be locked to the locking portion 3 a of the rack 3. Once the lock member 510 is locked to the locking portion 3a of a rack 3, the rack 3 is transferred to the elevator unit 430 by the linear driving device.

[88] After a rack 3 is completely transferred to the elevator 430, the rack 3 is in a fixed state, and a board 1 loaded on the rack 3 is withdrawn and transferred from/to the rack 3 by the board loading device 210. According to a withdrawn/inserted state of a board 1 from/to a rack, the elevator unit 430 is moved to a next board 1 by being vertically moved.

[89] Once all boards 1 has been finished with sorting process in a rack 3 loaded on the elevator 430, the elevator 430 is moved to an empty loading deck 411.

[90] The rack transferring unit 500 pushes the rack 3 into the empty loading deck 411, and then is moved to the elevator unit 430. The elevator unit 430 is moved to the loading deck 411 on which a board to be sorted is loaded.

[91] Then, the rack transferring unit 500 withdraws the board 1 from the rack 3.

[92] As the present features may be embodied in several forms without departing from the characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, unless otherwise specified, but rather should be construed broadly within its scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalents of such metes and bounds are therefore intended to be embraced by the appended claims.