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Title:
HEAT−TREATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2004/027845
Kind Code:
A1
Abstract:
A heat−treating apparatus comprising a reaction chamber accommodating an object to be treated, a heat−insulating body surrounding the reaction chamber, holes defined in the heat−insulating body, annular spacer members provided in the holes, and heater elements inserted in the annular spacer members.

Inventors:
SAITO TAKANORI
OSANAI HISAEI
Application Number:
PCT/JP2002/009730
Publication Date:
April 01, 2004
Filing Date:
September 20, 2002
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05B3/62; F27B5/14; F27B5/16; F27D1/00; F27D11/02; H01L21/00; H01L21/205; H01L21/22; (IPC1-7): H01L21/205; F27D1/00; F27D11/02; H01L21/22; H05B3/62
Foreign References:
JP2001208478A2001-08-03
JP2001007035A2001-01-12
JPH0297659A1990-04-10
Attorney, Agent or Firm:
Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo, JP)
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