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Patent Searching and Data


Title:
APPLICATION METHOD AND APPLICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/102201
Kind Code:
A1
Abstract:
A method for forming a coating film on a substrate by supplying an application liquid thereon. A substrate holding section for horizontally holding a substrate is caused to hold the substrate. Then, while the discharge opening of an application nozzle is positioned close to the substrate and is moved relative to the substrate, an application liquid is extracted from the discharge opening by the capillary effect and applied to the substrate, the application nozzle having flow paths for the application liquid which include the discharge opening, the flow paths being configured in the form of capillary tubes. After that, the substrate is rotated at a speed at which the application liquid on the substrate is not scattered from the substrate. The substrate is rotated by rotating the substrate holding section about a vertical axis.

Inventors:
SHIRAISHI, Masatoshi (1-1 Fukuhara, Koshi Cit, Kumamoto 16, 〒8611116, JP)
白石 雅敏 (〒16 熊本県合志市福原1-1 東京エレクトロン九州株式会社内 Kumamoto, 〒8611116, JP)
Application Number:
JP2011/051616
Publication Date:
August 25, 2011
Filing Date:
January 27, 2011
Export Citation:
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Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
東京エレクトロン株式会社 (〒25 東京都港区赤坂五丁目3番1号 Tokyo, 〒1076325, JP)
SHIRAISHI, Masatoshi (1-1 Fukuhara, Koshi Cit, Kumamoto 16, 〒8611116, JP)
International Classes:
B05D1/26; B05C11/08; B05D1/40; G03F7/16
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (Hazuki International, Kakubari Building 1-20, Sumiyoshi-cho, Shinjuku-k, Tokyo 65, 〒1620065, JP)
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Claims: