Title:
APPLICATION OF POROUS NANO-COPPER FILM IN PACKAGING AND INTERCONNECTION OF ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2023/097787
Kind Code:
A1
Abstract:
The application of a porous nano-copper film in the packaging and interconnection of electronic devices, relating to the technical field of the manufacture of metallic functional materials for electronic devices. Provided in the present invention is an application of a porous nano-copper film as an electronic device packaging and interconnection structure. According to the present invention, in order to prevent the occurrence of the oxidation phenomenon, the porous nano film is directly used as a welding material. The porous nano-copper film has the advantages that the influence of the oxidation phenomenon can be completely eliminated or reduced, the porous nano-copper film is suitable for welding a large-area chip, and the shape, thicknesses and size can easily be controlled.
Inventors:
ZHU PENGLI (CN)
WANG CHUNCHENG (CN)
SUN RONG (CN)
WANG CHUNCHENG (CN)
SUN RONG (CN)
Application Number:
PCT/CN2021/138142
Publication Date:
June 08, 2023
Filing Date:
December 15, 2021
Export Citation:
Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
B82Y30/00; H01L23/488; B82Y40/00; H01L21/48
Foreign References:
| CN111607811A | 2020-09-01 | |||
| CN107127468A | 2017-09-05 | |||
| CN108091633A | 2018-05-29 | |||
| CN109295327A | 2019-02-01 | |||
| CN108385069A | 2018-08-10 | |||
| US20190067239A1 | 2019-02-28 |
Attorney, Agent or Firm:
BEIJING ZHONG XUN TONG DA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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