Title:
AQUEOUS BONDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/104134
Kind Code:
A1
Abstract:
Disclosed is an aqueous bonding composition comprising: (A) a sugar syrup; (B) an inorganic acid ammonium salt; and (C) a metal salt. The sugar syrup (A) preferably comprises at least one selected from waste molasses, ice molasses, and crude saccharide. The metal salt (C) preferably comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength while being capable of bonding at a comparatively low temperature, and is particularly useful to produce a wood-based material. Further, disclosed is a wood-based material obtainable by using the composition.
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Inventors:
TAMOGAMI TSUYOSHI (JP)
YOSHIDA YOSHIO (JP)
YOSHIDA YOSHIO (JP)
Application Number:
PCT/JP2016/005131
Publication Date:
June 22, 2017
Filing Date:
December 14, 2016
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
B27N3/00; C09J103/00; C07H3/02; C07H3/04
Domestic Patent References:
| WO2015072437A1 | 2015-05-21 | |||
| WO2010001988A1 | 2010-01-07 | |||
| WO2015056357A1 | 2015-04-23 |
Foreign References:
| EP2465986A1 | 2012-06-20 | |||
| EP0001501A1 | 1979-04-18 | |||
| EP2457943A1 | 2012-05-30 | |||
| US4524164A | 1985-06-18 | |||
| JP2009503193A | 2009-01-29 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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