Title:
AQUEOUS BONDING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/221117
Kind Code:
A1
Abstract:
Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt.
The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.
Inventors:
TAMOGAMI TSUYOSHI (JP)
YOSHIDA YOSHIO (JP)
HAYAKAWA TADASHI (JP)
YOSHIDA YOSHIO (JP)
HAYAKAWA TADASHI (JP)
Application Number:
PCT/JP2018/017522
Publication Date:
December 06, 2018
Filing Date:
May 02, 2018
Export Citation:
Assignee:
HENKEL JAPAN LTD (JP)
International Classes:
C04B26/28; C04B14/42; C09J105/00
Domestic Patent References:
| WO2017072186A1 | 2017-05-04 |
Foreign References:
| KR101595275B1 | 2016-02-18 | |||
| US20080020948A1 | 2008-01-24 | |||
| JPS5931901B2 | 1984-08-04 | |||
| JPS5628889B2 | 1981-07-04 | |||
| JP6062099B1 | 2017-01-18 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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