Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
AQUEOUS CUTTING FLUID AND AQUEOUS CUTTING AGENT
Document Type and Number:
WIPO Patent Application WO/2010/143649
Kind Code:
A1
Abstract:
Disclosed is an aqueous cutting fluid which is characterized by containing a modified silicone (A) in an amount of 0.01 to 20% by mass. The aqueous cutting fluid containing 0.01 to 20% by mass of a modified silicone enables the dispersion of abrasive grains therein highly stably, exhibits excellent viscosity stability of an aqueous cutting agent contained therein, and has higher working accuracy than those of conventional cutting fluids.

More Like This:
JP06304860POLISHING METHOD FOR THIN FILM MAGNETIC HEAD
JP10034524POLISHING DEVICE FOR CMP
JP11204469PAD CLEANING SYSTEM OF SEMICONDUCTOR MANUFACTURING EQUIPMENT AND CLEANING METHOD
Inventors:
TANII Ichiro (17-33, Kitago 2-chome, Echizen-sh, Fukui 02, 〒9150802, JP)
谷井　一郎 (〒02 福井県越前市北府二丁目１７番３３号　日信化学工業株式会社内 Fukui, 〒9150802, JP)
HAYASHI Takayuki (17-33, Kitago 2-chome, Echizen-sh, Fukui 02, 〒9150802, JP)
林　貴幸 (〒02 福井県越前市北府二丁目１７番３３号　日信化学工業株式会社内 Fukui, 〒9150802, JP)
Application Number:
JP2010/059752
Publication Date:
December 16, 2010
Filing Date:
June 09, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nissin Chemical Industry Co., Ltd. (17-33, Kitago 2-chome Echizen-sh, Fukui 02, 〒9150802, JP)
日信化学工業株式会社 (〒02 福井県越前市北府二丁目１７番３３号 Fukui, 〒9150802, JP)
TANII Ichiro (17-33, Kitago 2-chome, Echizen-sh, Fukui 02, 〒9150802, JP)
谷井　一郎 (〒02 福井県越前市北府二丁目１７番３３号　日信化学工業株式会社内 Fukui, 〒9150802, JP)
HAYASHI Takayuki (17-33, Kitago 2-chome, Echizen-sh, Fukui 02, 〒9150802, JP)
International Classes:
B24B37/00; C08K5/053; C08L83/08; C08L83/12; B24B27/06; H01L21/304
Attorney, Agent or Firm:
KOJIMA Takashi (GINZA OHTSUKA Bldg. 2F, 16-12 Ginza 2-chome, Chuo-k, Tokyo 61, 〒1040061, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: WATERPROOF BOX

Next Patent: SCROLL FLUID MACHINE