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Title:
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING
Document Type and Number:
WIPO Patent Application WO/2007/069488
Kind Code:
A1
Abstract:
Disclosed is an aqueous dispersion for chemical mechanical polishing which contains (A) abrasive grains having a pore volume of not less than 0.14 ml/g and (B) a dispersion medium.

Inventors:
IKEDA NORIHIKO (JP)
UENO TOMIKAZU (JP)
Application Number:
PCT/JP2006/324168
Publication Date:
June 21, 2007
Filing Date:
December 04, 2006
Export Citation:
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Assignee:
JSR CORP (JP)
IKEDA NORIHIKO (JP)
UENO TOMIKAZU (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
JPH0927002A1997-01-28
JP2000109804A2000-04-18
JP2004153286A2004-05-27
JP2004269577A2004-09-30
JP2005097445A2005-04-14
JPH05326469A1993-12-10
JPH09270402A1997-10-14
JP2000109809A2000-04-18
JP2001007061A2001-01-12
JP2001185514A2001-07-06
JPS60235631A1985-11-22
Other References:
See also references of EP 1962334A4
Attorney, Agent or Firm:
OFUCHI, Michie et al. (Ogikubo TM Bldg. 26-13, Ogikubo 5-chom, Suginami-ku Tokyo 51, JP)
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