Title:
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING
Document Type and Number:
WIPO Patent Application WO/2007/069488
Kind Code:
A1
Abstract:
Disclosed is an aqueous dispersion for chemical mechanical polishing which
contains (A) abrasive grains having a pore volume of not less than 0.14 ml/g and
(B) a dispersion medium.
Inventors:
IKEDA NORIHIKO (JP)
UENO TOMIKAZU (JP)
UENO TOMIKAZU (JP)
Application Number:
PCT/JP2006/324168
Publication Date:
June 21, 2007
Filing Date:
December 04, 2006
Export Citation:
Assignee:
JSR CORP (JP)
IKEDA NORIHIKO (JP)
UENO TOMIKAZU (JP)
IKEDA NORIHIKO (JP)
UENO TOMIKAZU (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
JPH0927002A | 1997-01-28 | |||
JP2000109804A | 2000-04-18 | |||
JP2004153286A | 2004-05-27 | |||
JP2004269577A | 2004-09-30 | |||
JP2005097445A | 2005-04-14 | |||
JPH05326469A | 1993-12-10 | |||
JPH09270402A | 1997-10-14 | |||
JP2000109809A | 2000-04-18 | |||
JP2001007061A | 2001-01-12 | |||
JP2001185514A | 2001-07-06 | |||
JPS60235631A | 1985-11-22 |
Other References:
See also references of EP 1962334A4
Attorney, Agent or Firm:
OFUCHI, Michie et al. (Ogikubo TM Bldg. 26-13, Ogikubo 5-chom, Suginami-ku Tokyo 51, JP)
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