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Patent Searching and Data


Title:
AQUEOUS ETHYLENE RESIN DISPERSION AND AQUEOUS HEAT SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/054496
Kind Code:
A1
Abstract:
Provided is an aqueous ethylene resin dispersion which is capable of forming a coating film that has excellent airtightness and adhesiveness by being applied to a substrate such as a fiber substrate. An aqueous ethylene resin dispersion according to the present invention contains a copolymer, which contains an ethylene unit and an α,β-unsaturated carboxylic acid salt unit, a fatty acid salt and an aqueous medium; and this aqueous ethylene resin dispersion is obtained by dispersing the copolymer and the fatty acid salt in the aqueous medium.

Inventors:
MIZUKAWA JUNICHI (JP)
OKAMOTO MASAFUMI (JP)
SUGIHARA NORIHIRO (JP)
MIYAZAKI HIRONOBU (JP)
Application Number:
PCT/JP2018/034236
Publication Date:
March 21, 2019
Filing Date:
September 14, 2018
Export Citation:
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Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08L23/00; C08J3/03; C08K5/098; D06M13/188; D06M15/263; D06M101/20
Domestic Patent References:
WO2016088556A12016-06-09
Foreign References:
JP2002003657A2002-01-09
JP2001106838A2001-04-17
JPS4637892B11971-11-08
JPH0291139A1990-03-30
JPS6218450A1987-01-27
JPS6211542A1987-01-20
JPS6211540A1987-01-20
JP2009513759A2009-04-02
JP2002522662A2002-07-23
JPS50135141A1975-10-27
Other References:
See also references of EP 3683265A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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