Title:
AQUEOUS RESIN COMPOSITION FOR FORMING A THICK FILM, AND SURFACE TREATMENT METHOD USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/155262
Kind Code:
A1
Abstract:
Disclosed is an aqueous resin composition for forming a thick film. Said composition can be used to form a thick film on a target surface of a concrete structure or the like. Furthermore, said film can be dried within 12 hours of application, and the applied film is highly durable and resistant to, for example, water, acids, and alkalis. Also disclosed is a surface treatment method using the aforementioned aqueous resin composition. The disclosed aqueous resin composition is characterized by a nonvolatile content between 65% and 80% by mass and by containing an aqueous synthetic resin emulsion (A) and a glass filler (B). The disclosed surface treatment method is characterized in that an aqueous resin composition for forming a thick film is applied to a target surface and dried, thereby forming a film between 0.1 and 2.0 mm thick. Further provided is a concrete-structure surface-treatment method characterized in that an aqueous resin composition for forming a thick film is applied to a concrete structure and dried.
Inventors:
NAKAMURA KIMIHIKO (JP)
Application Number:
PCT/JP2011/059525
Publication Date:
December 15, 2011
Filing Date:
April 18, 2011
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
NAKAMURA KIMIHIKO (JP)
NAKAMURA KIMIHIKO (JP)
International Classes:
C09D201/00; C09D5/02; C09D7/61; C09D125/14; C09D133/04
Foreign References:
| JPH0827400A | 1996-01-30 | |||
| JP2009280787A | 2009-12-03 | |||
| JP2010159408A | 2010-07-22 | |||
| JPH08120192A | 1996-05-14 | |||
| JPH111656A | 1999-01-06 | |||
| JP2007277568A | 2007-10-25 |
Attorney, Agent or Firm:
Tamura, Ryosuke (JP)
Ryosuke Tamura (JP)
Ryosuke Tamura (JP)
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Claims: