Title:
AQUEOUS SURFACE TREATING AGENT AND SURFACE-TREATED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2007/026716
Kind Code:
A1
Abstract:
Disclosed is a stable aqueous surface treating agent for constructional/civil engineering structures which is able to impart a structure made of a constructional/civil engineering material such as stone and concrete, particularly one made of a porous material, with excellent water/oil repellency (water/oil proof property), antifouling property, weather resistance and durability. Specifically disclosed is an aqueous surface treating agent containing (A) at least one fluorine-containing polymer selected from (A1) polyfluoroalkyl group-containing poly(meth)acrylates and (A2) polyfluoroalkyl group-containing polyurethanes, in an aqueous medium. The aqueous surface treating agent usually contains (B) a surface active agent, and preferably contains (C) a silicone and (D) a silane compound having a hydrolyzable group and/or a partial hydrolysis-condensation product of a silane compound having a hydrolyzable group.
Inventors:
ASADA SHIGENORI (JP)
IBUKI HITOSHI (JP)
MAEKAWA TAKASHIGE (JP)
SUGIYAMA KAZUNORI (JP)
IBUKI HITOSHI (JP)
MAEKAWA TAKASHIGE (JP)
SUGIYAMA KAZUNORI (JP)
Application Number:
PCT/JP2006/317012
Publication Date:
March 08, 2007
Filing Date:
August 29, 2006
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
ASADA SHIGENORI (JP)
IBUKI HITOSHI (JP)
MAEKAWA TAKASHIGE (JP)
SUGIYAMA KAZUNORI (JP)
ASADA SHIGENORI (JP)
IBUKI HITOSHI (JP)
MAEKAWA TAKASHIGE (JP)
SUGIYAMA KAZUNORI (JP)
International Classes:
C09D133/16; C04B41/63; C04B41/64; C09D5/02; C09D151/06; C09D175/04; C09D183/04
Foreign References:
JP2001049166A | 2001-02-20 | |||
JP2004115691A | 2004-04-15 | |||
JP2001206919A | 2001-07-31 | |||
JPH07118600A | 1995-05-09 | |||
JPH04248821A | 1992-09-04 | |||
JPH0853648A | 1996-02-27 | |||
JP2004338980A | 2004-12-02 |
Other References:
See also references of EP 1930385A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo 42, JP)
Download PDF:
Previous Patent: SIMULATION SYSTEM AND PROGRAM
Next Patent: ROTARY ELECTRIC MACHINE AND ELECTROMAGNETIC DEVICE
Next Patent: ROTARY ELECTRIC MACHINE AND ELECTROMAGNETIC DEVICE