Title:
AROMATIC OLIGOMER, PHENOLIC RESIN COMPOSITION CONTAINING THE SAME, AND EPOXY RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2001/077192
Kind Code:
A1
Abstract:
An aromatic oligomer useful as, e.g., a modifier for epoxy resin compositions; a phenolic resin composition containing the oligomer; and an epoxy resin composition useful for the sealing of electrical/electronic parts and as a circuit board material, etc. The aromatic oligomer is one which is obtained by polymerizing monomers consisting mainly of one or more aromatic olefins comprising at least 20 wt.% acenaphthylene and has a softening point of 80 to 250°C. The phenolic resin composition and epoxy resin composition are obtained by incorporating 3 to 200 parts by weight of the aromatic oligomer into 100 parts by weight of a phenolic resin and an epoxy resin, respectively. The cured epoxy resin is obtained by curing the epoxy resin composition.
Inventors:
KAJI MASASHI (JP)
YONEKURA KIYOKAZU (JP)
YONEKURA KIYOKAZU (JP)
Application Number:
PCT/JP2001/003072
Publication Date:
October 18, 2001
Filing Date:
April 10, 2001
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
KAJI MASASHI (JP)
YONEKURA KIYOKAZU (JP)
KAJI MASASHI (JP)
YONEKURA KIYOKAZU (JP)
International Classes:
C08F2/44; C08F32/08; C08F283/00; C08G59/40; C08L61/06; C08L63/00; H01L23/14; C08L45/00; H01L23/29; H01L23/31; H05K1/03; (IPC1-7): C08F32/08; C08F212/04; C08L45/00; C08L25/02; C08L61/06; C08L63/00
Foreign References:
| JPH11343386A | 1999-12-14 | |||
| JPH11302360A | 1999-11-02 | |||
| JPH1129694A | 1999-02-02 | |||
| US4418187A | 1983-11-29 | |||
| GB1362046A | 1974-07-30 | |||
| JPH03100005A | 1991-04-25 | |||
| JPH04300906A | 1992-10-23 | |||
| JPH03166204A | 1991-07-18 | |||
| JP2001019725A | 2001-01-23 |
Attorney, Agent or Firm:
Naruse, Katsuo (Central Shinbashi Bldg. 11-5 Nishi-shinbashi
2-chome Minato-ku, Tokyo, JP)
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