Title:
AROMATIC POLYAMIDE FILMS FOR TRANSPARENT FLEXIBLE SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2012/129422
Kind Code:
A3
Abstract:
The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300 C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances > 80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.
Inventors:
ZHANG DONG (US)
HARRIS FRANK (US)
SUN LIMIN (US)
HARRIS FRANK (US)
SUN LIMIN (US)
Application Number:
PCT/US2012/030158
Publication Date:
January 10, 2013
Filing Date:
March 22, 2012
Export Citation:
Assignee:
AKRON POLYMER SYSTEMS INC (US)
International Classes:
C08J5/18; B29D7/01; C08G69/26; C08L77/06; H01L21/00
Domestic Patent References:
| WO2008044851A1 | 2008-04-17 |
Foreign References:
| JP2000273168A | 2000-10-03 | |||
| US20060106193A1 | 2006-05-18 | |||
| EP0610379B1 | 1998-07-01 | |||
| US20110034666A1 | 2011-02-10 |
Other References:
See also references of EP 2688942A4
Attorney, Agent or Firm:
EMERSON, Roger D. et al. (1914 Akron Peninsula RoadAkron, Ohio, US)
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