Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ARRANGEMENTS FOR LIGHT EMITTING DIODE PACKAGES
Document Type and Number:
WIPO Patent Application WO/2020/232668
Kind Code:
A1
Abstract:
Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LED packages are disclosed. Arrangements for LED packages are disclosed that provide improved reliability and improved emission characteristics in a variety of applications, including outdoor LED displays as well as general illumination. LED packages are disclosed with linear arrangements of LED chips and corresponding lenses to provide improved visibility and color mixing at higher viewing angles. LED packages are disclosed that include different types of lenses that are arranged within the same LED package depending on desired emission characteristics. Body structures for LED packages are disclosed that include arrangements for improved adhesion with encapsulant materials and optional potting materials to provide improved moisture barriers.

Inventors:
PANG CHAK HAU (CN)
SHENG JUZUO (CN)
LAU YUE KWONG (CN)
ZHONG ZHENYU (CN)
Application Number:
CN2019/087957
Publication Date:
November 26, 2020
Filing Date:
May 22, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CREE HUIZHOU SOLID STATE LIGHTING CO LTD (CN)
International Classes:
H01L33/00; H01L23/28
Domestic Patent References:
WO2019037094A12019-02-28
WO2019037094A12019-02-28
Foreign References:
US20090146158A12009-06-11
CN101123247A2008-02-13
CN204315572U2015-05-06
CN207353242U2018-05-11
US20100110659A12010-05-06
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
Download PDF: