Title:
ARRAY ANTENNA DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/064683
Kind Code:
A1
Abstract:
This array antenna device is provided with: a first dielectric substrate (1) to the front surface or back surface of which a first conductor ground plate (2) is applied; a plurality of patch antennas (3) applied to the first conductor ground plate (2); a plurality of conductive members (4) each having one end connected to the first conductor ground plate (2) so as to surround each of the plurality of patch antennas (3); and a second conductor ground plate (5) connected to the other end of each of the plurality of conductive members (4), wherein if the first conductor ground plate (2) is applied to the front surface of the first dielectric substrate (1), some of the plurality of conductive members (4) penetrate the first dielectric substrate (1), and the rest of the plurality of conductive members (4) function as a spacer for providing an air layer (6) between the first dielectric substrate (1) and the second conductor ground plate (5), and if the first conductor ground plate (2) is applied to the back surface of the first dielectric substrate (1), the plurality of conductive members (4) function as the spacer for providing the air layer (6) between the first conductor ground plate (2) and the second conductor ground plate (5).
Inventors:
YOKOKAWA KEI (JP)
NAKAMOTO NARIHIRO (JP)
FUKASAWA TORU (JP)
TAKAHASHI TOMOHIRO (JP)
OTSUKA MASATAKA (JP)
NAKAMOTO NARIHIRO (JP)
FUKASAWA TORU (JP)
TAKAHASHI TOMOHIRO (JP)
OTSUKA MASATAKA (JP)
Application Number:
PCT/JP2018/019225
Publication Date:
April 04, 2019
Filing Date:
May 18, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01Q23/00; H01L23/50; H01Q13/08
Domestic Patent References:
| WO2013121732A1 | 2013-08-22 | |||
| WO2012167283A2 | 2012-12-06 |
Foreign References:
| US20160172317A1 | 2016-06-16 | |||
| US20160087333A1 | 2016-03-24 | |||
| JP2011097526A | 2011-05-12 | |||
| JP2007324712A | 2007-12-13 | |||
| JP2009188895A | 2009-08-20 |
Other References:
PINEL, S. ET AL.: "3D integrated LTCC module using mu/BGA technology for compact C-band RF front-end module", 2002 IEEE MTT- S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, 2002, pages 1553 - 1556, XP001113901
HONG, W. B. ET AL.: "24-element antenna- in-package for stationary 60-GHz communication scenarios", IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, vol. 10, 2011, pages 738 - 741, XP011403014, DOI: 10.1109/LAWP.2011.2162640
CARRILLO-RAMIREZ, R. ET AL.: "A Highly integrated millimeter-wave active antenna array using BCB and silicon substrate", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 52, no. 6, 2004, pages 1648 - 1653, XP001195918, DOI: 10.1109/TMTT.2004.828469
See also references of EP 3667821A4
HONG, W. B. ET AL.: "24-element antenna- in-package for stationary 60-GHz communication scenarios", IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, vol. 10, 2011, pages 738 - 741, XP011403014, DOI: 10.1109/LAWP.2011.2162640
CARRILLO-RAMIREZ, R. ET AL.: "A Highly integrated millimeter-wave active antenna array using BCB and silicon substrate", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 52, no. 6, 2004, pages 1648 - 1653, XP001195918, DOI: 10.1109/TMTT.2004.828469
See also references of EP 3667821A4
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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