Title:
ARRAY ANTENNA DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/214959
Kind Code:
A1
Abstract:
This array antenna device (1) comprises: a dielectric layer (2a) provided on a ground conductor plate (10a); a plurality of patch elements provided on the dielectric layer (2a); a dielectric layer (2b) provided on the patch elements (5); a plurality of slots (8) that feed high-frequency signals to the plurality of patch elements (5); a metal pillar (6) extending in the thickness direction straddling the dielectric layer (2a) and the dielectric layer (2b); and a conductor pattern 7 provided on the dielectric layer (2b) corresponding to the position of the metal pillar (6), wherein the metal pillar (6) does not contact the ground conductor plate (10a) and the conductor pattern 7.
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Inventors:
UESAKA TAKASHI (JP)
GOTO JUN (JP)
FUKASAWA TORU (JP)
GOTO JUN (JP)
FUKASAWA TORU (JP)
Application Number:
PCT/JP2020/017599
Publication Date:
October 28, 2021
Filing Date:
April 24, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01Q1/52; H01Q13/08; H01Q21/06
Domestic Patent References:
| WO2018225537A1 | 2018-12-13 |
Foreign References:
| JP2020053908A | 2020-04-02 | |||
| FR2602917A1 | 1988-02-19 |
Attorney, Agent or Firm:
SANNO PATENT ATTORNEYS OFFICE (JP)
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