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Patent Searching and Data


Title:
ARRAY CAMERA MODULE HAVING HEIGHT DIFFERENCE, CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/113709
Kind Code:
A1
Abstract:
An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portions at least partially extend towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Inventors:
WANG MINGZHU (CN)
TANAKA TAKEHIKO (JP)
CHEN ZHENYU (CN)
GUO NAN (CN)
ZHAO BOJIE (CN)
MEI ZHEWEN (CN)
Application Number:
CN2017/117579
Publication Date:
June 28, 2018
Filing Date:
December 20, 2017
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/232
Foreign References:
CN104660909A2015-05-27
CN105791648A2016-07-20
CN105893578A2016-08-24
JP2008172523A2008-07-24
Other References:
See also references of EP 3544284A4
Attorney, Agent or Firm:
NINGBO RAYMOND IP AGENCY FIRM (CN)
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