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Title:
ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/133089
Kind Code:
A1
Abstract:
Provided are an array substrate (10), a chip on film (20), a display panel (100), and a display device (200). The array substrate (10) has a display area (Q1) and a binding area (Q2) surrounding the display area (Q1). The array substrate (10) comprises a plurality of first bonding pads (1) in the binding area (Q2), wherein the longitudinal direction of the first bonding pads (1) is oriented towards the display area (Q1). In this way, binding between the array substrate (10) and the chip on film (20) is improved.

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Inventors:
LI HONG (CN)
CHEN LIQIANG (CN)
Application Number:
PCT/CN2016/080646
Publication Date:
August 10, 2017
Filing Date:
April 29, 2016
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
G02F1/1362; H01L27/12; H01L21/60; H01L23/488; H01L27/32
Foreign References:
CN105529338A2016-04-27
CN203365865U2013-12-25
CN102346321A2012-02-08
CN204855999U2015-12-09
CN104681507A2015-06-03
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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