Title:
ARRAY SUBSTRATE, ELECTRONIC DEVICE, AND ARRAY SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/068745
Kind Code:
A1
Abstract:
An array substrate, an electronic device, and an array substrate manufacturing method. The array substrate comprises a base substrate (100), and a first transistor (10) and a second transistor (20) disposed on the base substrate (100). A first terminal of the first transistor (10) is connected to a second terminal of the second transistor (20). The array substrate further comprises a photodiode (30). The photodiode (30) comprises a first electrode, a second electrode, and a photosensitive layer disposed between the first electrode and the second electrode. The first electrode of the photodiode (30) and a gate (12) of the first transistor (10) are electrically connected. The first transistor (10) and the second transistor (20) are connected in series to form a control circuit. The control circuit has improved uniformity and stability. When a fingerprint identification module is integrated with a display panel, the photodiode (30) in the fingerprint identification module is connected to the control circuit, such that the control circuit can better receive an electrical signal sent by the photodiode (30).
Inventors:
ZHOU TIANMIN (CN)
HUANG RUI (CN)
YANG WEI (CN)
WANG LIZHONG (CN)
QIANG ZHAOHUI (CN)
YANG TAO (CN)
QIANG LI (CN)
HUANG RUI (CN)
YANG WEI (CN)
WANG LIZHONG (CN)
QIANG ZHAOHUI (CN)
YANG TAO (CN)
QIANG LI (CN)
Application Number:
PCT/CN2020/117062
Publication Date:
April 15, 2021
Filing Date:
September 23, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L27/12; G06K9/00; H01L21/77; H01L27/32
Foreign References:
| CN110634890A | 2019-12-31 | |||
| CN107123654A | 2017-09-01 | |||
| CN108376250A | 2018-08-07 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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