Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD, DISPLAY PANEL, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/109712
Kind Code:
A1
Abstract:
Provided are an array substrate and a manufacturing method, a display panel, and a display apparatus. The sequence for peeling a first photoresist layer is changed, an ohmic contact layer film layer and an active layer film layer are etched at a conductive channel area (equivalent to carrying out conductive channel etching of a TFT) so as to execute the step of carrying out wet peeling on the first photoresist layer on a source-drain electrode before the ohmic contact layer and the active layer are formed. In this way, forming the conductive channel area after carrying out wet peeling may prevent copper ions from polluting a conductive channel area of the TFT during wet peeling. Moreover, compared with the usage of dry peeling to peel the first photoresist layer on the source-drain electrode, the productivity can be improved, and the surface of Cu metal at a lap joint between the source-drain electrode and a pixel electrode is prevented from being oxidized.
Inventors:
HAN XIAO (CN)
BAI JINCHAO (CN)
DING XIANGQIAN (CN)
GUO HUIBIN (CN)
BAI JINCHAO (CN)
DING XIANGQIAN (CN)
GUO HUIBIN (CN)
Application Number:
PCT/CN2018/107092
Publication Date:
June 13, 2019
Filing Date:
September 21, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE DISPLAY TECH CO (CN)
BEIJING BOE DISPLAY TECH CO (CN)
International Classes:
H01L27/12; H01L21/77
Foreign References:
| CN108010924A | 2018-05-08 | |||
| CN101188242A | 2008-05-28 | |||
| CN104766859A | 2015-07-08 | |||
| US20100155733A1 | 2010-06-24 | |||
| CN104091784A | 2014-10-08 | |||
| CN102237305A | 2011-11-09 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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