Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/042126
Kind Code:
A1
Abstract:
Disclosed in the present disclosure are an array substrate and a manufacturing method therefor, the manufacturing method comprising the following steps: providing a first substrate; providing a first mask, and disposing an active switch on the first substrate; providing a second photomask, and disposing photoresist on an active switch, which comprises the following process performed in sequence: wet etching the active switch for the first time, performing ashing processing on the photoresist for the first time, dry etching the active switch for the first time, wet etching the active switch for the second, performing ashing processing on the photoresist for the second time, and dry etching the active switch for the second time; providing a third photomask, and disposing a protective layer on a metal; providing a fourth photomask, and disposing a pixel electrode layer on the protective layer.
Inventors:
CHO EN-TSUNG (CN)
Application Number:
PCT/CN2018/100590
Publication Date:
March 07, 2019
Filing Date:
August 15, 2018
Export Citation:
Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
H01L27/12
Foreign References:
| CN107591415A | 2018-01-16 | |||
| CN107591416A | 2018-01-16 | |||
| CN106505033A | 2017-03-15 | |||
| CN105097949A | 2015-11-25 | |||
| CN102646634A | 2012-08-22 | |||
| JP2003158068A | 2003-05-30 |
Attorney, Agent or Firm:
SHENZHEN JINGZHI INTELLECTUAL PROPERTY AGENCY CO. LTD (CN)
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