Title:
ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND BACKLIGHT MODULE
Document Type and Number:
WIPO Patent Application WO/2021/134794
Kind Code:
A1
Abstract:
An array substrate, a manufacturing method therefor, and a backlight module. Before electroplating a first metal layer (15) on a pattern of a seed layer (11), the method further comprises: forming, on a side of a base substrate (10) having a lead wire electrode (12) formed thereon, a pattern of a compensation electrode trace (13) electrically connected to the lead wire electrode (12), wherein the compensation electrode trace (13) is at least located at a second side of a wire routing region (AA), and a first side and the second side are on different sides of the wire routing region (AA). During electroplating, the lead wire electrode (12) is connected to a cathode of a power supply. Since the compensation electrode trace (13) is electrically connected to the lead wire electrode (12), the compensation electrode trace (13) increases the area of an electroplating cathode generating electric field lines, and increases uniform electric field lines at the periphery of the wire routing region (AA), such that a peripheral region of the electroplating is expanded beyond the wire routing region (AA), thereby improving the distribution of electric field lines within the wire routing region (AA), and enhancing electroplating uniformity.
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| WO/1999/050597 | TANDEM LIGHTING PANEL |
| WO/2019/148746 | DISPLAY DEVICE |
| JP2021135320 | DISPLAY DEVICE |
Inventors:
CAO ZHANFENG (CN)
LIU YINGWEI (CN)
WANG KE (CN)
ZHANG GUOCAI (CN)
WANG JIANGUO (CN)
LIANG ZHIWEI (CN)
LI HAIXU (CN)
DI MUXIN (CN)
LIU YINGWEI (CN)
WANG KE (CN)
ZHANG GUOCAI (CN)
WANG JIANGUO (CN)
LIANG ZHIWEI (CN)
LI HAIXU (CN)
DI MUXIN (CN)
Application Number:
PCT/CN2020/070325
Publication Date:
July 08, 2021
Filing Date:
January 03, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
G02F1/13357; C25D5/02; C25D5/34
Foreign References:
| CN110632796A | 2019-12-31 | |||
| CN110402034A | 2019-11-01 | |||
| CN101096770A | 2008-01-02 | |||
| CN106997888A | 2017-08-01 | |||
| US20160215409A1 | 2016-07-28 |
Other References:
See also references of EP 4086696A4
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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