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Patent Searching and Data


Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/114834
Kind Code:
A1
Abstract:
An array substrate and manufacturing method thereof, and a display device. Said manufacturing method comprises: forming a first semiconductor pattern (101) and a first insulation layer (110) on a substrate (S); forming a first gate pattern (111) and a second gate pattern (112) isolated from each other; forming a second insulation layer (120); forming a second semiconductor pattern (102); forming a first metal pattern (121), and a second metal pattern (122) and a third metal pattern (123) respectively lapping the second semiconductor pattern (102); forming a third insulation layer (130); and forming a first via hole (131), a second via hole (132), first source/drain electrodes (141S, 141D), and second source/drain electrodes (142S, 142D), the first source/drain electrodes (141S, 141D) are respectively connected to the first semiconductor pattern (101) by means of the first via hole (131), and the second source/drain electrodes (142S, 142D) are respectively connected to the second semiconductor pattern (102) by means of the second via hole (132). The manufacturing method can achieve normal operation of cleaning with hydrofluoric acid after manufacturing via holes by means of one patterning process, avoiding the influence of hydrofluoric acid on an oxide semiconductor layer, and simplifying the manufacturing process, thereby reducing the production cost.

Inventors:
LI HAIXU (CN)
WANG JIANGUO (CN)
Application Number:
PCT/CN2018/121313
Publication Date:
June 20, 2019
Filing Date:
December 14, 2018
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L21/84; H01L27/12
Foreign References:
CN107910302A2018-04-13
CN107452757A2017-12-08
US20110049523A12011-03-03
CN106920801A2017-07-04
US9147719B22015-09-29
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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