Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/128966
Kind Code:
A1
Abstract:
Provided are an array substrate and a manufacturing method thereof. The array substrate comprises the following layers sequentially formed on a base substrate: a metal light-shielding layer, a first buffer layer, a second buffer layer, a polysilicon layer, a gate insulation layer, and a gate. The second buffer layer has a pre-formed recess arranged at a position corresponding to the polysilicon layer. The polysilicon layer is positioned inside the recess and is co-planar with the second buffer layer, thereby solving a problem in which layers of an array substrate have non-uniform thicknesses.
Inventors:
GAO LING (CN)
Application Number:
PCT/CN2018/123388
Publication Date:
July 04, 2019
Filing Date:
December 25, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L27/12; G02F1/133
Foreign References:
| CN108198820A | 2018-06-22 | |||
| CN107369693A | 2017-11-21 | |||
| US20050140868A1 | 2005-06-30 | |||
| CN105390505A | 2016-03-09 | |||
| CN103268047A | 2013-08-28 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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