Title:
ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/165835
Kind Code:
A1
Abstract:
An array substrate includes a substrate, a packaging layer, and at least one sensor. The packaging layer is over the substrate. Each sensor includes a sensing thin-film transistor and a sensing unit, electrically coupled with each other. The sensing thin-film transistor is between the package layer and the substrate, and the sensing unit is over a side of the package layer away from the substrate. The array substrate can also include a plurality of display thin-film transistors. The sensing thin-film transistor in each sensor can be at substantially same film layers, or optionally further of a same structure and a same type, as each display thin- film transistor. A display panel containing the array substrate, and a method for manufacturing the array substrate, are also disclosed.
Inventors:
QIN YUNKE (CN)
DONG XUE (CN)
LI ZHIFU (CN)
WANG HAISHENG (CN)
LIU YINGMING (CN)
GUO YUZHEN (CN)
GU PINCHAO (CN)
ZHOU LIN (CN)
DONG XUE (CN)
LI ZHIFU (CN)
WANG HAISHENG (CN)
LIU YINGMING (CN)
GUO YUZHEN (CN)
GU PINCHAO (CN)
ZHOU LIN (CN)
Application Number:
PCT/CN2018/123463
Publication Date:
September 06, 2019
Filing Date:
December 25, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L27/12; H01L21/77; H01L27/32; G06F3/041
Foreign References:
| CN108376686A | 2018-08-07 | |||
| CN103887324A | 2014-06-25 | |||
| CN107589847A | 2018-01-16 | |||
| CN205427390U | 2016-08-03 | |||
| CN107092399A | 2017-08-25 | |||
| US20130077034A1 | 2013-03-28 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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