Title:
ARRAY SUBSTRATE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/210619
Kind Code:
A1
Abstract:
Provided in the present invention are an array substrate and a preparation method. The method comprises the following steps: first, providing a substrate, sequentially manufacturing a buffer layer, a polysilicon layer, and a first gate insulating layer on the substrate; then, manufacturing a first gate electrode metal layer on the first gate insulating layer, manufacturing a first photoresist non-adhesiveness-preventing metal film, and, when exposed to light and developed, forming a patterned gate electrode and a first photoresist non-adhesiveness-preventing metal pattern located on the surface of the gate electrode.
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Inventors:
LI CHAO (CN)
Application Number:
PCT/CN2018/101835
Publication Date:
November 07, 2019
Filing Date:
August 23, 2018
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L27/12; H01L21/77
Foreign References:
| CN103094304A | 2013-05-08 | |||
| CN105093747A | 2015-11-25 | |||
| CN103296034A | 2013-09-11 | |||
| US20160027813A1 | 2016-01-28 |
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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