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Patent Searching and Data


Title:
ARRAY SUBSTRATE, PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/233453
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of display, and discloses an array substrate, a preparation method therefor, and a display device. When dielectric layers, such as a buffer layer, an interlayer dielectric layer, and a gate insulation layer, are formed between a source-drain electrode and a substrate, the thickness of at least one dielectric layer among said dielectric layers underneath a first through hole for connecting a drain electrode and an anode is increased, which is to say that the drain electrode is raised to be further away from the substrate, causing the drain electrode to be closer to a surface of a planarization layer that faces away from the substrate, i.e., reducing the thickness of a portion of the planarization layer above the drain electrode. When a method such as photolithography or etching is used to form a first through hole for connecting an anode and a source electrode on a planarization layer and a passivation layer, and in the situation in which the thickness of the passivation layer is fixed, the distance for which the first through hole needs to penetrate the planarization layer is shortened. The etching of the first through hole may be completed merely by depositing a relatively thin layer of photoresist on the surface of the planarization layer, which will not extend exposure time, waste the photoresist, or cause damage to the planarization layer and thereby affect light-emitting quality.

Inventors:
FANG JINGANG (CN)
DING LUKE (CN)
LIU JUN (CN)
ZHOU BIN (CN)
CHENG JUN (CN)
Application Number:
CN2020/089820
Publication Date:
November 26, 2020
Filing Date:
May 12, 2020
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L27/32; H01L27/12
Foreign References:
CN110112146A2019-08-09
CN108269944A2018-07-10
CN108269944A2018-07-10
US20140306229A12014-10-16
US20080197357A12008-08-21
JPH10186404A1998-07-14
CN102708792A2012-10-03
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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