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Patent Searching and Data


Title:
ARRAY SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/232801
Kind Code:
A1
Abstract:
The present application provides an array substrate, comprising a flexible substrate, a driving circuit layer, and at least bending material layer, wherein the driving circuit layer is formed on one side of the flexible substrate; and at least one bending material layer is formed in the driving circuit layer. The bending performance of the array substrate is enhanced by providing at least one bending material layer in the driving circuit layer.

Inventors:
BAI YAMEI (CN)
Application Number:
CN2019/094690
Publication Date:
November 26, 2020
Filing Date:
July 04, 2019
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H01L27/12
Foreign References:
CN106601133A2017-04-26
CN106356380A2017-01-25
CN103545320A2014-01-29
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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