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Patent Searching and Data


Title:
ARTICLE MANUFACTURING APPARATUS AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/175057
Kind Code:
A1
Abstract:
A forming mold (6) serving as an interchangeable member attached to a resin sealing device (1) is provided with a sign (9), and the sign (9) is provided with an information forming surface (9a) having a fine pattern indicating first information including information used to specify the forming mold (6). An information reading means (10) reads the fine pattern, and a deciphering section (DE) acquires the first information on the basis of the read fine pattern. A determination section (J) makes a determination by comparing the first information with previously stored second information including information used to specify the forming mold (6). On the basis of each determination result, a control section (8) controls the resin sealing device (1) such that the resin sealing device (1) operates when the forming mold (6) conforms to the second information and such that a manufacturing apparatus indicates nonconformity of the forming mold to the second information when the forming mold (6) does not conform to the second information. It is thus possible to prevent the forming mold (6) that is used in the resin sealing device (1) from being a non-conforming article.

Inventors:
NAKAJIMA, Takanobu (5 Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-sh, Kyoto 05, 〒6018105, JP)
YAMASHITA, Nobuya (5 Kamitoba Kamichoshi-cho, Minami-ku, Kyoto-sh, Kyoto 05, 〒6018105, JP)
Application Number:
JP2016/062138
Publication Date:
November 03, 2016
Filing Date:
April 15, 2016
Export Citation:
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Assignee:
TOWA CORPORATION (5 Kamitoba Kamichoshi-cho, Minami-ku Kyoto-sh, Kyoto 05, 〒6018105, JP)
International Classes:
B29C33/30; B21D37/00; B21D37/04; B29C45/76; B30B15/02; H01L21/56
Foreign References:
JP2009184220A2009-08-20
JPH06246894A1994-09-06
JP2003347328A2003-12-05
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (Nakanoshima Central Tower, 2-7 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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