Title:
ARTICLE AND METHOD FOR BONDING SUBSTRATES WITH LARGE TOPOGRAPHIES
Document Type and Number:
WIPO Patent Application WO/2012/018685
Kind Code:
A3
Abstract:
The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.
Inventors:
WEBB RICHARD J (US)
MAHONEY WAYNE S (US)
LARSON ERIC G (US)
MAHONEY WAYNE S (US)
LARSON ERIC G (US)
Application Number:
PCT/US2011/045900
Publication Date:
May 10, 2012
Filing Date:
July 29, 2011
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
International Classes:
H01L21/02
Foreign References:
| US6048799A | 2000-04-11 | |||
| US20100052161A1 | 2010-03-04 | |||
| US20050006767A1 | 2005-01-13 | |||
| US20070077685A1 | 2007-04-05 |
Attorney, Agent or Firm:
KULPRATHIPANJA, Ann et al. (Office of Intellectual Property CounselPost Office Box 3342, Saint Paul MN, US)
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