Title:
ASSAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/045551
Kind Code:
A1
Abstract:
The present invention makes it possible to improve liquid control performance in an assay device. This assay device includes a micro flow passage 1, 31, 41 through which a liquid can be allowed to flow, a porous medium for absorption 2, 42 disposed spaced apart from one end portion of the micro flow passage, and a separating space 3, 43 disposed between said one end portion of the micro flow passage and the porous medium for absorption. The assay device additionally includes two sideways ventilation passages 6, 46 which are adjacent to both sides, in a width direction perpendicular to a direction of flow, of the micro flow passage, in such a way as to communicate with the micro flow passage, and through which air can be allowed to flow.
Inventors:
FUCHIWAKI YUSUKE (JP)
Application Number:
PCT/JP2019/033846
Publication Date:
March 05, 2020
Filing Date:
August 29, 2019
Export Citation:
Assignee:
AIST (JP)
International Classes:
G01N35/08; G01N37/00
Foreign References:
| JP2015172492A | 2015-10-01 | |||
| JP6037184B2 | 2016-12-07 | |||
| US20110036152A1 | 2011-02-17 | |||
| JP2007170840A | 2007-07-05 | |||
| US20150219623A1 | 2015-08-06 | |||
| US20180207564A1 | 2018-07-26 | |||
| JP5291343B2 | 2013-09-18 | |||
| JP2010515877A | 2010-05-13 | |||
| JPS6037184B2 | 1985-08-24 |
Other References:
See also references of EP 3845909A4
Attorney, Agent or Firm:
OKUYAMA, Shoichi et al. (JP)
Download PDF:
Previous Patent: SHEET-FORM HEATING ELEMENT, AND HEATING DEVICE
Next Patent: ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
Next Patent: ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME