Title:
COPPER/CERAMIC ASSEMBLY AND INSULATING CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/286857
Kind Code:
A1
Abstract:
This copper/ceramic assembly (10) has: a copper member (12, 13) made of copper or a copper alloy; and a ceramic member (11) made of silicon nitride. The copper member (12, 13) is joined to the ceramic member (11). At a junction interface between the ceramic member (11) and the copper member (12, 13), an active metal nitride layer (21) is formed on the ceramic member (11) side. The area percentage of an active metal compound containing Si and an active metal in a region extending by 10 μm from the active metal nitride layer (21) toward the copper member (12) side is at most 10%. The ratio PA/PB of the area percentage PA of the active metal compound in a peripheral region (A) of the copper member (12) to the area percentage PB of the active metal compound in a central region (B) of the copper member (12) is in the range of 0.7-1.4.
Inventors:
TERASAKI NOBUYUKI (JP)
Application Number:
PCT/JP2022/027855
Publication Date:
January 19, 2023
Filing Date:
July 15, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/13; C04B37/02; H05K1/03; H05K1/09
Domestic Patent References:
| WO2021124923A1 | 2021-06-24 | |||
| WO2020203787A1 | 2020-10-08 | |||
| WO2021015122A1 | 2021-01-28 |
Foreign References:
| JP2008024561A | 2008-02-07 | |||
| JP2018008869A | 2018-01-18 | |||
| JP2013211546A | 2013-10-10 | |||
| JP2016184606A | 2016-10-20 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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