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Patent Searching and Data


Title:
ASSEMBLY AND LIGHT-SOURCE DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/184371
Kind Code:
A1
Abstract:
An assembly according to the present disclosure comprises: a substrate 1 in which a metal layer 9 is arranged on a first principal surface 7a of an insulating base material 7; a metal joining layer 3; and a metal member 5. The metal joining layer 3 is located between the metal layer 9 of the substrate 1 and the metal member 5. The metal joining layer 3 includes a nickel layer 11, a solder layer 13, and a composite layer 15 in which the nickel and the solder are mixed. The nickel layer 11, the composite layer 15, and the solder layer 13 are arranged in this order from the metal layer 9 side toward the metal member 5 side. The nickel in the composite layer 15 extends from the nickel layer 11 in the thickness direction and forms asperities.

Inventors:
YAMAMOTO SENTAROU (JP)
FURUKUBO YOUJI (JP)
OKAMOTO KAZUHIRO (JP)
MATSUMOTO YUHEI (JP)
SUGAI KOUICHIROU (JP)
NISHIMOTO KAZUKI (JP)
Application Number:
PCT/JP2020/009381
Publication Date:
September 17, 2020
Filing Date:
March 05, 2020
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
B32B15/04; F21S2/00; F21V29/503; F21V29/70; H01L23/12; H01L23/40; H01L33/62; H01L33/64; H05K1/02; F21Y115/10
Domestic Patent References:
WO2012063638A12012-05-18
WO2014142310A12014-09-18
WO2017188237A12017-11-02
Foreign References:
JP2011183797A2011-09-22
JPS6334932A1988-02-15
JP2012116126A2012-06-21
Other References:
See also references of EP 3936332A4
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