Title:
ASSEMBLY METHOD AND DEVICE FOR CIRCUIT STRUCTURAL MEMBER, AND CIRCUIT STRUCTURAL MEMBER
Document Type and Number:
WIPO Patent Application WO/2019/052237
Kind Code:
A1
Abstract:
Provided are an assembly method and device for a circuit structural member, and a circuit structural member. The method comprises: measuring a depth and path of a channel between at least one chip and a printed circuit board (PCB), the at least one chip is arranged on the PCB; according to the depth and path of the channel between the at least one chip and the PCB and a predetermined heat dissipation parameter, determining a thickness and path of a heat dissipation reinforcement material, so as to configure a dispensing parameter and path; according to the dispensing parameter and path, applying the heat dissipation reinforcement material in the channel between the at least one chip and the PCB; and heating the heat dissipation reinforcement material to a first predetermined temperature, so that the heat dissipation reinforcement material permeates into the chip and the PCB.
Inventors:
HUANG ZHULIN (CN)
Application Number:
PCT/CN2018/090368
Publication Date:
March 21, 2019
Filing Date:
June 08, 2018
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01L23/29; H01L23/34; H05K1/02
Foreign References:
| CN105023886A | 2015-11-04 | |||
| CN104823276A | 2015-08-05 | |||
| CN1358411A | 2002-07-10 | |||
| CN103426835A | 2013-12-04 | |||
| CN102169865A | 2011-08-31 | |||
| US5920112A | 1999-07-06 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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