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Patent Searching and Data


Title:
ASSEMBLY SUBSTRATE STRUCTURE FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND DISPLAY DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/033261
Kind Code:
A1
Abstract:
An embodiment relates to: an assembly substrate structure for a semiconductor light-emitting device; and a display device comprising same. The assembly substrate structure for a semiconductor light-emitting device according to one embodiment may comprise a first assembly substrate structure and a second assembly substrate structure which are disposed away from each other on a substrate. The first assembly substrate structure may comprise: a first electrode and a second electrode which are located away from each other by a first distance; and a first partition wall having a circular first assembly hole. The second assembly substrate structure may comprise: a third electrode and a fourth electrode which are located away from each other by a second distance greater than the first distance; and a second partition wall having elliptical second assembly holes. The second assembly holes may comprise a 2-1 assembly hole and a 2-2 assembly hole which at least partially overlap each other.

Inventors:
KIM MYOUNGSOO (KR)
PARK CHANGSEO (KR)
KIM GUNHO (KR)
LEE MINWOO (KR)
KIM JUNGSUB (KR)
Application Number:
PCT/KR2021/018345
Publication Date:
March 09, 2023
Filing Date:
December 06, 2021
Export Citation:
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Assignee:
LG ELECTRONICS INC (KR)
International Classes:
H01L33/48; H01L27/15; H05K1/18
Foreign References:
KR20190143840A2019-12-31
KR102145193B12020-08-28
KR20180030454A2018-03-23
US20150093860A12015-04-02
KR102205693B12021-01-21
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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