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Title:
ASYMMETRIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2008/023839
Kind Code:
A1
Abstract:
A material capable of molding of articles, including even an asymmetric electronic component, exhibiting high mechanical properties and a low warpage deformation and excelling in all performances, such as heat resistance and fluidity. In particular, there is provided an asymmetric electronic component formed from a liquid crystal polymer composition comprising (A) fibrous filler of 5 to 30 μm average fiber diameter and 250 to 350 μm weight average fiber length excluding portion of 10 μm or less fiber length wherein the ratio of portion of 700 μm or greater fiber length is within 5 wt.% and (B) plate filler of 0.5 to 200 μm average particle diameter, the total amount of filling ingredients (A) and (B) ranging from 40 to 60 wt.% based on the composition, the weight fraction of ingredient (A) ranging from 10 to 20 wt.%, the weight fraction of ingredient (B) ranging from 30 to 40 wt.%, which asymmetric electronic component has no symmetry on any of the axial plane XY, axial plane YZ and axial plane XZ of shaped item.

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Inventors:
FUKATSU HIROKI (JP)
KAYUKAWA SEIJI (JP)
OHSHIBA HIROKAZU (JP)
NISHIKAWA RAITA (JP)
Application Number:
PCT/JP2007/066824
Publication Date:
February 28, 2008
Filing Date:
August 23, 2007
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
FUKATSU HIROKI (JP)
KAYUKAWA SEIJI (JP)
OHSHIBA HIROKAZU (JP)
NISHIKAWA RAITA (JP)
International Classes:
C08L101/12; C08K7/00; H01R13/46
Foreign References:
JP2003246923A2003-09-05
JP2003171538A2003-06-20
JP2003128895A2003-05-08
JP2001106923A2001-04-17
JP2000178443A2000-06-27
JP2006164749A2006-06-22
JP2005339837A2005-12-08
JP2004213682A2004-07-29
Attorney, Agent or Firm:
FURUYA, Satoshi et al. (2-17-8 Nihonbashi-Hamacho,Chuo-k, Tokyo 07, JP)
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