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Patent Searching and Data


Title:
ASYMMETRIC EMBOSSING MOLD APPARATUS
Document Type and Number:
WIPO Patent Application WO/2015/199261
Kind Code:
A1
Abstract:
The present invention relates to an asymmetric embossing mold apparatus. An asymmetric embossing mold apparatus according to the present invention comprises: an object including a membrane or film to be delaminated; and an upper mold and a lower mold arranged on an upper side and a lower side of the object, respectively, wherein blades for removing the membrane or film formed on the object protrude in an embossed shape from the lower surface of the upper mold and the upper surface of the lower mold, and the blade has asymmetric opposite sides with reference to a vertical line with respect to the lower surface of the upper mold or the upper surface of the lower mold. By the above configuration, the asymmetric embossing mold apparatus according to the present invention can achieve an easy cutting of a workpiece during a cutting operation and also improve the lifespan of an embossing mold.

Inventors:
RYOO KI-TAEK (KR)
PARK HYUNG-GEUN (KR)
KIM MIN-WOOK (KR)
KANG MYUNG-CHANG (KR)
Application Number:
PCT/KR2014/005682
Publication Date:
December 30, 2015
Filing Date:
June 26, 2014
Export Citation:
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Assignee:
FINETECH CO LTD (KR)
PUSAN NAT UNIV IND COOP FOUND (KR)
GLOBAL FRONTIER HYBRID INTERFACE MATERIALS (KR)
International Classes:
B26F1/38; B26F1/44
Foreign References:
JPH11300687A1999-11-02
JPH06328395A1994-11-29
US20030201582A12003-10-30
JPH06218717A1994-08-09
Attorney, Agent or Firm:
NOH, Kyong-kyu (KR)
노경규 (KR)
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