ATOM PROBE EQUIPMENT AND PRELIMINARY PROCESSING METHOD FOR SAMPLE BY IT

Title:

ATOM PROBE EQUIPMENT AND PRELIMINARY PROCESSING METHOD FOR SAMPLE BY IT

Document Type and Number:

WIPO Patent Application WO/2005/090941

Kind Code:

A1

Abstract:

A preliminary processing technology for a sample which locally cuts out the part of a device to be analyzed and processing it into a needle-like projection, and a technology of realizing SAP analysis on an atomic level by ensuring stabilized ion evaporation sequentially even in the case of a sample of multilayer structure including an element layer of small evaporation electric field in a situation described below. The preliminary processing method for a sample used on atom probe equipment comprises a step for cutting the desired observing part of the sample into a block using an FIB equipment, a step for transferring the sample cut into a block onto a sample substrate and fixing the sample in place, and a step for processing the block-like sample fixed onto the sample substrate into a needle-point shape by FIB etching. The sample processed into a needle-point shape is shaped such that the layer direction of the multilayer structure becomes parallel with the longitudinal direction of the needle.

Inventors:

KAITO TAKASHI (JP)

Application Number:

PCT/JP2005/003495

Publication Date:

September 29, 2005

Filing Date:

March 02, 2005

Export Citation:

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Assignee:

SII NANOTECHNOLOGY INC (JP)
KAITO TAKASHI (JP)

International Classes:

G01N1/32; (IPC1-7): G01N1/32

Domestic Patent References:

WO2002093615A1

2002-11-21

Foreign References:

JP2000162102A	2000-06-16
JP2003007241A	2003-01-10
JP2001208659A	2001-08-03
JPH05312696A	1993-11-22
JP2000230891A	2000-08-22
JP2002042715A	2002-02-08
JP2000162102A	2000-06-16
JP2001208659A	2001-08-03

Other References: