Title:
ATTACHABLE MODULAR ELECTRONIC SYSTEMS
Document Type and Number:
WIPO Patent Application WO2004008832
Kind Code:
A3
Abstract:
A apparatus (200) having layers. A first layer (230) has a conductive adhesive region (231) and a non-conductive adhesive region (232). A second layer (210) has an electronic component (215) in electrical connection to the conductive adhesive regions (231) in the first layer (230) so that the conductive adhesive regions (231) provide contact points for the electronic component (215). A third layer (230) has an adhesive material to couple the apparatus to an object. A forth layer (250) substantially covers the third layer.
Inventors:
WALKER THOMAS J
Application Number:
PCT/US2003/023009
Publication Date:
July 08, 2004
Filing Date:
July 24, 2003
Export Citation:
Assignee:
EGGS IN THE PIPELINE LLC (US)
International Classes:
H01L25/16; H01L25/18; H05K1/18; H05K3/30; H05K3/32; (IPC1-7): H05K1/03
Foreign References:
| US6222740B1 | 2001-04-24 | |||
| US6021050A | 2000-02-01 | |||
| US6370013B1 | 2002-04-09 |
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