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Patent Searching and Data


Title:
ATTACHMENT DEVICE FOR ENDOSCOPE TOP PART
Document Type and Number:
WIPO Patent Application WO/2018/194145
Kind Code:
A1
Abstract:
An embodiment of the present disclosure includes an endoscope tip part assembly used on an endoscope during surgery. The endoscope tip part assembly can include a base which is configured so as to receive an endoscope top part and is configured so as not to be separated from the endoscope top part during surgery. The endoscope tip part assembly may also include a plurality of struts connected by a webbing, and the plurality of struts are folded to be flat during insertion and may assume a balloon shape during withdrawal.

Inventors:
SUGITA NORIYUKI (JP)
Application Number:
PCT/JP2018/016219
Publication Date:
October 25, 2018
Filing Date:
April 19, 2018
Export Citation:
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Assignee:
HOYA CORP (JP)
International Classes:
A61B1/00
Foreign References:
JP2016507303A2016-03-10
JP2011024829A2011-02-10
JP2003033319A2003-02-04
JP2003180611A2003-07-02
JP2003339631A2003-12-02
JP2008528239A2008-07-31
JP2008178511A2008-08-07
JP2013169422A2013-09-02
US20040077926A12004-04-22
US20170112365A12017-04-27
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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