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Title:
ATTACHMENT STRUCTURE FOR INFRARED SENSOR
Document Type and Number:
WIPO Patent Application WO/2013/105500
Kind Code:
A1
Abstract:
This attachment structure for an infrared sensor is for attaching an infrared sensor to equipment. The attachment structure for an infrared sensor is provided with: an accommodating part (6) that accommodates the infrared sensor; a housing (5) that is attached to the equipment; and a linking mechanism that attaches the accommodating part (6) to the housing (5). The linking mechanism is constituted such that the attachment position of the accommodating part (6) to the housing (5) is selectable from a plurality of positions having different angles for the accommodating part (6) in relation to the housing (5).

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Inventors:
SHIBATA NAOKI
KITACHI NORIYUKI
ANDATSU KENJI
ITO YOSHIHIRO
YAMAMOTO SOU
AKITA TOMOHIRO
KITAMURA HITOSHI
TSUTSUMI KYOKO
MAEDA YASUNARI
Application Number:
PCT/JP2013/000054
Publication Date:
July 18, 2013
Filing Date:
January 10, 2013
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
G01V8/20; E03C1/05; G01J1/02
Foreign References:
JP2003057359A2003-02-26
JP2003344153A2003-12-03
JP2002042619A2002-02-08
JP2002243542A2002-08-28
JP2003240864A2003-08-27
JPH01152284U1989-10-20
JPS6378287U1988-05-24
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
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Claims:



 
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