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Patent Searching and Data


Title:
ATTACHMENT STRUCTURE FOR RESIN MOLDING
Document Type and Number:
WIPO Patent Application WO/2017/212518
Kind Code:
A1
Abstract:
Provided is an attachment structure for a resin molding, said attachment structure being suitable for reducing manufacturing costs of a product comprising a configuration in which a second resin molding is attached to a first resin molding, and for improving the workability of attaching the second resin molding to the first resin molding. This structure for attaching a second resin molding (6) to a first resin molding (5) is configured such that, with a hooking pawl (15) hooked in a hooking hole (11), the second resin molding (6) is rotatably moved in the direction of the first resin molding (5) about the hooking pawl as a base point, whereby an engaging structure for an outer peripheral engaging pawl (13) and an outer peripheral engaging portion (9) is set, and a boss-fitting portion (16) is brought near to and fitted over a boss (12), thereby setting a fitting structure for the boss and the boss-fitting portion.

Inventors:
ASO Yuta (3316,Miyayama, Samukawa-machi,Koza-gu, Kanagawa 06, 〒2530106, JP)
Application Number:
JP2016/066726
Publication Date:
December 14, 2017
Filing Date:
June 06, 2016
Export Citation:
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Assignee:
KASAI KOGYO CO.,LTD. (3316, MiyayamaSamukawa-machi,Koza-gu, Kanagawa 06, 〒2530106, JP)
International Classes:
F16B5/10; B60J5/04; B60R13/02
Attorney, Agent or Firm:
WADA Shigenori et al. (Tohko Building 4F, 15-16Uchikanda 1-chome, Chiyoda-k, Tokyo 47, 〒1010047, JP)
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