Title:
ATTRACTIVE-ADHESION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/058183
Kind Code:
A1
Abstract:
An attractive-adhesion substrate according to the present disclosure has a base, an attractive-adhesion electroconductive layer, a lead section, and a recessed section. The base has a first surface that retains an article being processed, and a second surface that is positioned on the opposite side from the first surface. The base comprises an insulator. The attractive-adhesion electroconductive layer is positioned in the interior of the base and extends along the first surface. The lead section leads from the attractive-adhesion electroconductive layer to the second-surface side. The recessed section is positioned in the second surface. The lead section is exposed at the bottom surface of the recessed section. The attractive-adhesion electroconductive layer has a penetrating section in which the insulator penetrates through the inner side of the recess and/or the surroundings of the recess in plan view.
Inventors:
ITO MASAKI (JP)
FUJIO KAZUHIKO (JP)
KAWANABE YASUNORI (JP)
FUJIO KAZUHIKO (JP)
KAWANABE YASUNORI (JP)
Application Number:
PCT/JP2023/033252
Publication Date:
March 21, 2024
Filing Date:
September 12, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/683
Domestic Patent References:
| WO2018159687A1 | 2018-09-07 |
Foreign References:
| JP2006005295A | 2006-01-05 | |||
| JP2019220503A | 2019-12-26 | |||
| JP2019175995A | 2019-10-10 | |||
| JP2016213237A | 2016-12-15 | |||
| JP2001345372A | 2001-12-14 | |||
| JP2016076646A | 2016-05-12 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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