Title:
Au-Sn-Ag BASED SOLDER PASTE, AND ELECTRONIC COMPONENT JOINED OR SEALED BY USING Au-Sn-Ag BASED SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2016/170906
Kind Code:
A1
Abstract:
The present invention provides a high-temperature Pb-free Au-Sn-Ag based solder paste that is superior in oxidation resistance and wettability, has a suitable melting point as a solder alloy for high temperature, is very low cost since the contained amount of Au is markedly less compared to an Au-based solder alloy such as an Au-Sn based solder alloy, and is superior in joining ability, stress reducing ability, and reliability, etc. The Au-Sn-Ag based solder paste of the present invention is characterized in that a solder alloy powder used for the solder paste contains Sn by more than 38.0 mass% but not more than 43.0 mass%, and Ag by more than 12.0 mass% but not more than 15.0 mass%, wherein the remaining portion is formed of Au.
Inventors:
ISEKI TAKASHI (JP)
Application Number:
PCT/JP2016/059400
Publication Date:
October 27, 2016
Filing Date:
March 24, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B23K35/30; C22C5/02; C22C30/04; H01L21/52; H01L23/02; H01L23/10; H03H9/02
Domestic Patent References:
| WO2006049024A1 | 2006-05-11 |
Foreign References:
| JP2008155221A | 2008-07-10 | |||
| JP2009190055A | 2009-08-27 | |||
| JP2009285683A | 2009-12-10 | |||
| JP2015157307A | 2015-09-03 |
Attorney, Agent or Firm:
SHINOHARA & COMPANY INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Shinohara international patent firm (JP)
Patent business corporation Shinohara international patent firm (JP)
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