Title:
AU-SN-AG SOLDER ALLOY AND SOLDER MATERIAL, ELECTRONIC COMPONENT SEALED USING SAID SOLDER ALLOY OR SOLDER MATERIAL, AND MOUNTED-ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/075983
Kind Code:
A1
Abstract:
This Au-Sn-Ag solder alloy is characterized by comprising Sn, Ag, Au, and elements unavoidably included during the manufacturing process, and having a composition adjusted such that the solidus line is within 280-400°C, and the solidus line and liquidus line are within 40°C of each other, thereby providing an Au-Sn-Ag solder alloy for high-temperature use having exceptional reflow wetting sufficient to permit use even in reflow joining of liquid crystal devices, SAW filters, MEMS, and the like, the solder alloy being particularly low in cost, and having excellent processability, reflow wetting, and reliability.
Inventors:
NAGATA HIROAKI (JP)
MURASE EIJI (JP)
SHIMIZU TOSHIKAZU (JP)
MURASE EIJI (JP)
SHIMIZU TOSHIKAZU (JP)
Application Number:
PCT/JP2015/074211
Publication Date:
May 19, 2016
Filing Date:
August 27, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B23K35/30; C22C1/02; C22C5/02; H05K3/34
Domestic Patent References:
| WO2006049024A1 | 2006-05-11 | |||
| WO2010010833A1 | 2010-01-28 |
Foreign References:
| JP2008155221A | 2008-07-10 | |||
| JP2014151329A | 2014-08-25 | |||
| JP2009190055A | 2009-08-27 | |||
| JP2009220147A | 2009-10-01 |
Other References:
See also references of EP 3219432A4
Attorney, Agent or Firm:
SHINOHARA & COMPANY INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Shinohara international patent firm (JP)
Patent business corporation Shinohara international patent firm (JP)
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