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Title:
AUTOMATIC BOARD-LOWERING MACHINE FOR ELECTROLYTIC PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/000778
Kind Code:
A1
Abstract:
Provided is an automatic board-lowering machine for an electrolytic plating device, provided with a machine frame (1) and a linear drive apparatus (2), transfer-loading apparatus (3), suction-cup apparatus (4), sensing control apparatus, and board-lowering sensing control apparatus (5) mounted on said machine frame (1); said linear drive apparatus (2) is capable of driving the transfer-loading apparatus (3) in linear motion between a material-pickup position (P3) adjacent to a board-lowering position (P1) and a material-discharge position (P4) adjacent to a board-raising position (P2); the suction-cup apparatus (4) is provided with a rotary motor (41), a first cylinder (42), a second cylinder (43), a suction cup (44), and a suction-cup drive mechanism. The automatic board-lowering machine for an electrolytic plating device is capable of automatically retrieving a PCB stopped at the board-lowering position from the clamp of the electrolytic plating device and transferring it to the board-raising position of the transfer surface of a post-electrolytic-plating processing device, and can operate automatically without requiring human labor.

Inventors:
DENG GAORONG (CN)
Application Number:
PCT/CN2016/112517
Publication Date:
January 04, 2018
Filing Date:
December 28, 2016
Export Citation:
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Assignee:
GUANGZHOU MING YI ELECTRONIC MACHINERY CO LTD (CN)
International Classes:
C25D17/28
Domestic Patent References:
WO2014009595A12014-01-16
Foreign References:
CN106087015A2016-11-09
CN201046999Y2008-04-16
CN2630264Y2004-08-04
CN104291112A2015-01-21
CN205152382U2016-04-13
CN104555396A2015-04-29
CN205011023U2016-02-03
CN205187345U2016-04-27
US5901997A1999-05-11
Attorney, Agent or Firm:
GUANGZHOU ZHIYOU PATENT & TRADEMARK AGENCY CO., LTD (CN)
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